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2012•Unpublished venueOpen access

Accelerating thermal simulations of 3D ICs with liquid cooling using neural networks

Alessandro Vincenzi, Arvind Sridhar, Martino Ruggiero, David Atienza

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Abstract

Vertical integration is a promising solution to further increase the performance of future ICs, but such 3D ICs present complex thermal issues that cannot be solved by conventional cooling techniques. Interlayer liquid cooling has been proposed to extract the heat accumulated within the chip. However, the development of liquid-cooled 3D ICs strongly relies on the availability of accurate and fast thermal models.

About this research paper

What this paper is about

Vertical integration is a promising solution to further increase the performance of future ICs, but such 3D ICs present complex thermal issues that cannot be solved by conventional cooling techniques. Interlayer liquid cooling has been proposed to extract the heat accumulated within the chip. However, the development of liquid-cooled 3D ICs strongly relies on the availability of accurate and fast thermal models.

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OpenAlex reports 6 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

Vertical integration is a promising solution to further increase the performance of future ICs, but such 3D ICs present complex thermal issues that cannot be solved by conventional cooling techniques. Interlayer liquid cooling has been proposed to extract the heat accumulated within the chip. However, the development of liquid-cooled 3D ICs strongly relies on the availability of accurate and fast thermal models.

Key concepts: Three-dimensional integrated circuit, Computer cooling, Thermal, Materials science, Artificial neural network, Water cooling, Chip, Thermal management of electronic devices and systems

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