Bing Shi, Ankur Srivastava
Abstract
This paper investigated micro-channel based liquid cooling in 3D-ICs. Specifically, the structure of 3D-IC with micro-channels, and its thermal/hydrodynamic modeling are studied. Also, the design challenges of micro-channel heat sinks in 3D-IC are summarized.
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This paper investigated micro-channel based liquid cooling in 3D-ICs. Specifically, the structure of 3D-IC with micro-channels, and its thermal/hydrodynamic modeling are studied. Also, the design challenges of micro-channel heat sinks in 3D-IC are summarized.
Key concepts: Computer cooling, Three-dimensional integrated circuit, Heat sink, Channel (broadcasting), Thermal, Materials science, 3d model, Thermal management of electronic devices and systems