2004•Unpublished venueRequires access
Experimental study of a flat silicon heat pipe with microcapillary grooves
C. Gillot, A. Lai, M. Ivanova, Yvan Avenas, Christian G. Schaeffer, Élise Fournier
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Abstract
An increase in power densities in electronic devices is a direct consequence of their miniaturization and performance improvements. We propose the use of flat miniature heat pipes with micro capillary grooves to spread heat flux across a heat sink. Silicon/water heat pipes were fabricated and tested to demonstrate the feasibility of heat spreading with this type of heat pipe.