2003•2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2Requires access
Thermal Analysis for Three-Dimensional Heat Spreader Integrated With Heat Sink
Yi‐Chia Wu, H. T. Chen, C. C. Lin, Y. H. Hung
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Abstract
An effective thermal analyzer for exploring the thermal performance of 3-D heat spreader having discrete heat sources integrated with heat sink has been successfully developed in the study. The thermal performances such as local temperature distributions and isotherms on heat spreader surfaces; and overall resistance of heat spreader/sink assembly are investigated. Besides, a series of parametric studies have been performed. The parameters and conditions explored include the size and heat dissipation rate of heat sources, size and material of heat spreaders and heat sinks, type of convection in heat sink, and contact conditions between heat spreader and heat sink. The superiority of the developed thermal analyzer through two sample cases having multi-discrete heat sources has finally been demonstrated.