2005Unpublished venueRequires access

Electron-beam assisted platinum deposition as a protective layer for FIB and TEM applications

Wing Yin Kwong, Weijian Zhang

Open publisher page 22 citations

Abstract

In FIB (focused ion beam) applications, ion beam (Ga+) assisted Pt deposition is commonly used as a protection layer for subsequent milling for cross-section or TEM sample preparation. But the damage induced by ion beam during Pt deposition makes tiny feature analysis very difficult or impossible. In this paper, a new method by using two deposition steps, first using electron beam induced Pt deposition then subsequently follow by ion beam induced Pt deposition, was developed to address the above tough issues. By this new method, nearly no damage was introduced to the features of interest during Pt deposition. This new technique was applied to practical FA cases and demonstrated to be successful.

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What this paper is about

In FIB (focused ion beam) applications, ion beam (Ga+) assisted Pt deposition is commonly used as a protection layer for subsequent milling for cross-section or TEM sample preparation. But the damage induced by ion beam during Pt deposition makes tiny feature analysis very difficult or impossible. In this paper, a new method by using two deposition steps, first using electron beam induced Pt deposition then subsequently follow by ion beam induced Pt deposition, was developed to address the above tough issues. By this new method, nearly no damage was introduced to the features of interest during Pt deposition. This new technique was applied to practical FA cases and demonstrated to be successful.

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OpenAlex reports 22 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

In FIB (focused ion beam) applications, ion beam (Ga+) assisted Pt deposition is commonly used as a protection layer for subsequent milling for cross-section or TEM sample preparation. But the damage induced by ion beam during Pt deposition makes tiny feature analysis very difficult or impossible. In this paper, a new method by using two deposition steps, first using electron beam induced Pt deposition then subsequently follow by ion beam induced Pt deposition, was developed to address the above tough issues. By this new method, nearly no damage was introduced to the features of interest during Pt deposition. This new technique was applied to practical FA cases and demonstrated to be successful.

Key concepts: Electron beam-induced deposition, Focused ion beam, Deposition (geology), Ion beam-assisted deposition, Materials science, Ion beam, Ion beam deposition, Layer (electronics)

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