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2005•Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and PhenomenaRequires access

Influence of process variables on electron beam chemical vapor deposition of platinum

David Cartier Beaulieu, Yong Ding, Zhong Lin Wang, W. J. Lackey

Open publisher page 29 citations

Abstract

Electron beam chemical vapor deposition was performed in a modified environmental scanning electron microscope to deposit platinum structures. Process variables including voltage, beam current, deposition time, dwell time, and line time were studied in statistically designed and analyzed experiments on fiber (pillar-like structures) and line (wall-like structures) deposition. Deposition rates and geometric features such as aspect ratio were optimized. Results from the experimentation showed the importance of the beam current, voltage, and adsorbate replenishment to the deposition process. Growth rates up to 0.9μm∕min were obtained for short deposition times.

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What this paper is about

Electron beam chemical vapor deposition was performed in a modified environmental scanning electron microscope to deposit platinum structures. Process variables including voltage, beam current, deposition time, dwell time, and line time were studied in statistically designed and analyzed experiments on fiber (pillar-like structures) and line (wall-like structures) deposition. Deposition rates and geometric features such as aspect ratio were optimized. Results from the experimentation showed the importance of the beam current, voltage, and adsorbate replenishment to the deposition process. Growth rates up to 0.9μm∕min were obtained for short deposition times.

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Available abstract

Electron beam chemical vapor deposition was performed in a modified environmental scanning electron microscope to deposit platinum structures. Process variables including voltage, beam current, deposition time, dwell time, and line time were studied in statistically designed and analyzed experiments on fiber (pillar-like structures) and line (wall-like structures) deposition. Deposition rates and geometric features such as aspect ratio were optimized. Results from the experimentation showed the importance of the beam current, voltage, and adsorbate replenishment to the deposition process. Growth rates up to 0.9μm∕min were obtained for short deposition times.

Key concepts: Electron beam physical vapor deposition, Electron beam-induced deposition, Deposition (geology), Chemical vapor deposition, Dwell time, Scanning electron microscope, Materials science, Platinum

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