2010Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)Requires access

Interface degradation of Al heavy wire bonds on power semiconductors during active power cycling measured by the shear test

Jens Goehre, Martin Schneider‐Ramelow, Ute Geisler, Klaus‐Dieter Lang

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Abstract

Art. 5730637

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Art. 5730637

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OpenAlex reports 39 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

Art. 5730637

Key concepts: Wire bonding, Power cycling, Materials science, Interconnection, Power module, Direct shear test, Lift (data mining), Semiconductor

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