1999•Microelectronics ReliabilityRequires access

High current bond design rules based on bond pad degradation and fusing of the wire

B.H. Krabbenborg

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Key concepts: Degradation (telecommunications), Wire bonding, Bond, Current (fluid), Bond graph, Materials science, Computer science, Reliability engineering

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High current bond design rules based on bond pad degradation and fusing of the wire — Research Paper | ScholarLens