Time domain analysis of a through hole via with time dependent skin effect model
Kevin Cai, George I. Costache
Abstract
Kevin Cai, George I. Costache
Abstract
This paper presents a transient simulation of a through hole via connecting transmission lines on both sides of a printed circuit board. The via is modeled by a lumped RLC equivalent circuit that takes into account the skin effect in the cylindrical conductor. In the analysis of the transmission line part, a new skin effect model accounting for the time dependent losses is included. A mathematical interface is established between discrete time domain solutions and a lumped element RLC circuit. Numerical results show reasonable response due to the through hole via.
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This paper presents a transient simulation of a through hole via connecting transmission lines on both sides of a printed circuit board. The via is modeled by a lumped RLC equivalent circuit that takes into account the skin effect in the cylindrical conductor. In the analysis of the transmission line part, a new skin effect model accounting for the time dependent losses is included. A mathematical interface is established between discrete time domain solutions and a lumped element RLC circuit. Numerical results show reasonable response due to the through hole via.
Key concepts: RLC circuit, Skin effect, Transmission line, Partial element equivalent circuit, Time domain, Equivalent circuit, Transient (computer programming), Conductor