RF characterization of ESD protection structures [RFIC applications]
Guang Chen, Haigang Feng, Haolu Xie, Rouying Zhan, Qiong Wu, Xiaokang Guan, A. Wang, K. Takasuka, S. Tamura, Zhihua Wang, Chun Zhang
Abstract
Guang Chen, Haigang Feng, Haolu Xie, Rouying Zhan, Qiong Wu, Xiaokang Guan, A. Wang, K. Takasuka, S. Tamura, Zhihua Wang, Chun Zhang
Abstract
ESD (electrostatic discharge) protection design for RF ICs is a challenging design problem. This paper reports a comprehensive RF characterization of various RF ESD protection structures, including S-parameters, parasitic capacitance and resistance. It is found that a dual-direction SCR type ESD protection structure is the best RF ESD protection solution and an optimized two/three-diode string is an attractive solution as well. A new optimization parameter, F-factor, is introduced to evaluate the overall performance of RF ESD protection structures. A dual-SCR structure of 257 /spl mu/m/sup 2/ for 2 kV ESD protection features 43.2 fF parasitic capacitance at 2.4 GHz and F=180. This work is conducted using a commercial 0.35 /spl mu/m BiCMOS technology.
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ESD (electrostatic discharge) protection design for RF ICs is a challenging design problem. This paper reports a comprehensive RF characterization of various RF ESD protection structures, including S-parameters, parasitic capacitance and resistance. It is found that a dual-direction SCR type ESD protection structure is the best RF ESD protection solution and an optimized two/three-diode string is an attractive solution as well. A new optimization parameter, F-factor, is introduced to evaluate the overall performance of RF ESD protection structures. A dual-SCR structure of 257 /spl mu/m/sup 2/ for 2 kV ESD protection features 43.2 fF parasitic capacitance at 2.4 GHz and F=180. This work is conducted using a commercial 0.35 /spl mu/m BiCMOS technology.
Key concepts: Electrostatic discharge, RFIC, Parasitic capacitance, Capacitance, BiCMOS, Electrical engineering, Radio frequency, Diode