Deepa Bhatt, Karen A. Williams, David A. Hutt, PAUL P. CONWAY
Abstract
Excimer laser machining of microvias and tracks in CMZ glass (100 mum thick) at 248 nm has been investigated and optimised in order to minimise hole taper, microcracking and debris.
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Excimer laser machining of microvias and tracks in CMZ glass (100 mum thick) at 248 nm has been investigated and optimised in order to minimise hole taper, microcracking and debris.
Key concepts: Surface micromachining, Excimer laser, Laser beam machining, Materials science, Laser, Machining, Excimer, Optoelectronics