2011Unpublished venueRequires access

High temperature physical modeling and verification of 4H-SiC lateral JFET device

Xueqian Zhong, Tao Wang, Qing Guo, Kuang Sheng

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Abstract

Silicon Carbide (SiC) lateral JFET (LJFET) has drawn significant attentions due to its excellent performance in high-temperature and high-frequency electronics applications. This paper establishes a comprehensive physical model, including both DC and AC characteristics, for 4H-SiC lateral JFET at room temperature and high temperature (300°C). Finite element numerical simulation and experimental measurement are carried out to verify the validity of the established physical model. Good agreements have been achieved among these three sets of results. For the first time, the modeling work studied the detailed operating mechanism and provided valuable design guidelines for SiC LJFET device at temperature as high as 300°C.

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What this paper is about

Silicon Carbide (SiC) lateral JFET (LJFET) has drawn significant attentions due to its excellent performance in high-temperature and high-frequency electronics applications. This paper establishes a comprehensive physical model, including both DC and AC characteristics, for 4H-SiC lateral JFET at room temperature and high temperature (300°C). Finite element numerical simulation and experimental measurement are carried out to verify the validity of the established physical model. Good agreements have been achieved among these three sets of results. For the first time, the modeling work studied the detailed operating mechanism and provided valuable design guidelines for SiC LJFET device at temperature as high as 300°C.

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OpenAlex reports 3 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

Silicon Carbide (SiC) lateral JFET (LJFET) has drawn significant attentions due to its excellent performance in high-temperature and high-frequency electronics applications. This paper establishes a comprehensive physical model, including both DC and AC characteristics, for 4H-SiC lateral JFET at room temperature and high temperature (300°C). Finite element numerical simulation and experimental measurement are carried out to verify the validity of the established physical model. Good agreements have been achieved among these three sets of results. For the first time, the modeling work studied the detailed operating mechanism and provided valuable design guidelines for SiC LJFET device at temperature as high as 300°C.

Key concepts: JFET, Silicon carbide, Materials science, Temperature measurement, Finite element method, Work (physics), Wide-bandgap semiconductor, Mechanical engineering

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