2004•Unpublished venueRequires access

SPICE model libraries for via transitions

Shaofeng Luan, G. Selli, Jun Fan, Mallory Lai, J.L. Knighten, N.W. Smith, R. Alexander, Giulio Antonini, A. Ciccomancini, Antonio Orlandi, James L. Drewniak

Open publisher page 13 citations

Abstract

A procedure of building SPICE models for signal via transitions between printed circuit board layers is presented in this paper. The method of extracting parameters of SPICE models from full-wave simulation tool is demonstrated. Then the validity of SPICE models is studied by comparing the solution from SPICE model with that from the full-wave simulation.

About this research paper

What this paper is about

Why it matters

OpenAlex reports 13 citations for this work. Citation counts describe recorded attention and do not establish research quality.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Available abstract

Key concepts: Spice, Computer science, Electronic engineering, Electronic circuit simulation, Electronic circuit, Engineering, Electrical engineering