Use of nickel(II) acetylacetonate and dimethylgold(III) acetylacetonate in gold on nickel plating
Ahmet Ozan Gezerman, Burcu Didem Çorbacıoğlu
Abstract
Ahmet Ozan Gezerman, Burcu Didem Çorbacıoğlu
Abstract
This study investigates the use of non-toxic materials in nickel and gold plating baths that are used to plate gold on nickel plated stainless steel surfaces. The physical and mechanical stability and adhesion of the plating obtained using such compositions are investigated. The thickness, colour and adhesion of the plating have been studied using X-ray measurements, visible spectrometry and hydrogen embrittlement tests respectively. The plating baths employed in this study, which contained nickel(II) acetylacetonate and dimethylgold(III) acetylacetonate, were found to be good alternatives to conventional nickel and gold plating baths because they contain toxic nickel sulphate and cyanide salts.
OpenAlex reports 2 citations for this work. Citation counts describe recorded attention and do not establish research quality.
A contribution statement is not available in the OpenAlex record.
Method details are not available in the OpenAlex metadata.
Findings are not separately available in the OpenAlex metadata.
Limitations are not available in the OpenAlex metadata.
Application details are not available in the OpenAlex metadata.
This study investigates the use of non-toxic materials in nickel and gold plating baths that are used to plate gold on nickel plated stainless steel surfaces. The physical and mechanical stability and adhesion of the plating obtained using such compositions are investigated. The thickness, colour and adhesion of the plating have been studied using X-ray measurements, visible spectrometry and hydrogen embrittlement tests respectively. The plating baths employed in this study, which contained nickel(II) acetylacetonate and dimethylgold(III) acetylacetonate, were found to be good alternatives to conventional nickel and gold plating baths because they contain toxic nickel sulphate and cyanide salts.
Key concepts: Nickel, Plating (geology), Materials science, Gold plating (software engineering), Metallurgy, Cyanide, Adhesion, Electroless nickel plating