Quantification of EUV resist outgassing
Wang Yueh, Heidi B. Cao, Vani Thirumala, Hokkin Choi
Abstract
Wang Yueh, Heidi B. Cao, Vani Thirumala, Hokkin Choi
Abstract
Outgassing from EUV photoresists under EUV irradiation must be minimal in order to prevent contamination of EUV optics. A better understanding of both the level of outgassing of current EUV resists, and the effect of outgassing on EUV optics is needed to set outgassing targets and to assess the risk of resist outgassing in EUV tools. In this paper, we document a technique for quantifying the EUV resist outgassing using both internal and external standards to baseline the GC/MS. In a comparison of internal and external standard, the two techniques give consistent baseline results. Quantification of the outgassing of a number of experimental EUV photoresists shows outgassing levels of 1E+10 - 1E+15 molecules/cm2 at the relevant lithographic dose. Protecting groups and PAG fragments are identified as the main outgassing components. The use of high activation energy resists, and non-ionic PAGs are identified as possible methods to reduce the outgassing levels of EUV photoresists.
OpenAlex reports 22 citations for this work. Citation counts describe recorded attention and do not establish research quality.
A contribution statement is not available in the OpenAlex record.
Method details are not available in the OpenAlex metadata.
Findings are not separately available in the OpenAlex metadata.
Limitations are not available in the OpenAlex metadata.
Application details are not available in the OpenAlex metadata.
Outgassing from EUV photoresists under EUV irradiation must be minimal in order to prevent contamination of EUV optics. A better understanding of both the level of outgassing of current EUV resists, and the effect of outgassing on EUV optics is needed to set outgassing targets and to assess the risk of resist outgassing in EUV tools. In this paper, we document a technique for quantifying the EUV resist outgassing using both internal and external standards to baseline the GC/MS. In a comparison of internal and external standard, the two techniques give consistent baseline results. Quantification of the outgassing of a number of experimental EUV photoresists shows outgassing levels of 1E+10 - 1E+15 molecules/cm2 at the relevant lithographic dose. Protecting groups and PAG fragments are identified as the main outgassing components. The use of high activation energy resists, and non-ionic PAGs are identified as possible methods to reduce the outgassing levels of EUV photoresists.
Key concepts: Outgassing, Extreme ultraviolet lithography, Resist, Extreme ultraviolet, Optics, Materials science, Lithography, Optoelectronics