1995•Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIERequires access

Patterned eutectic bonding with Al/Ge thin films for MEMS

P.M. Zavracky, Bao Vu

Abstract

In this paper, we report our results using eutectic bonding with the aluminum/germanium alloy to create high quality bonds. The results of a series of experiments conducted to optimize eutectic alloy bonding for MEMS are described. Issues discussed include surface preparation, eutectic composition, bonding apparatus and bonding conditions (temperature and time).

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Available abstract

Key concepts: Eutectic system, Eutectic bonding, Materials science, Germanium, Alloy, Microelectromechanical systems, Aluminium, Bonding strength