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2004•Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIERequires access

The guideline of reticle data management

Norihiko Miyazaki, Nobuyuki Iriki, M. Homma, T. Sato, M. Mori, Tadashi Imoriya, Toshio Onodera, TAKEHISA MATSUDA, Hidehiro Higashino, Kazushige Okuda, Iwao Higashikawa, Nobuyuki Yoshioka

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Abstract

We reported the Guideline(Ver. 1) of Reticle Data Management(RDM) Activity in 2001. Among we have been focused SoC(System on Chip) Business, we have been improved the efficiency over Design technology, Mask manufacturing and Wafer manufacturing. Especially, these subjects have been the lithography Cost including Reticle Cost, shorter life cycle of product, more difficult technique, lower cost and shorter total TAT from design to chip shipping. Guideline Ver 1.0 announced the standardization of interface contents over Design to Mask manufacture, and to wafer manufacture. Guideline Ver 2.0 will announce this RDM activity has been developed the optimization of a new engineering chain management in addition to the pattern data and the linkage to EDA in 2003.

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What this paper is about

We reported the Guideline(Ver. 1) of Reticle Data Management(RDM) Activity in 2001. Among we have been focused SoC(System on Chip) Business, we have been improved the efficiency over Design technology, Mask manufacturing and Wafer manufacturing. Especially, these subjects have been the lithography Cost including Reticle Cost, shorter life cycle of product, more difficult technique, lower cost and shorter total TAT from design to chip shipping. Guideline Ver 1.0 announced the standardization of interface contents over Design to Mask manufacture, and to wafer manufacture. Guideline Ver 2.0 will announce this RDM activity has been developed the optimization of a new engineering chain management in addition to the pattern data and the linkage to EDA in 2003.

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Available abstract

We reported the Guideline(Ver. 1) of Reticle Data Management(RDM) Activity in 2001. Among we have been focused SoC(System on Chip) Business, we have been improved the efficiency over Design technology, Mask manufacturing and Wafer manufacturing. Especially, these subjects have been the lithography Cost including Reticle Cost, shorter life cycle of product, more difficult technique, lower cost and shorter total TAT from design to chip shipping. Guideline Ver 1.0 announced the standardization of interface contents over Design to Mask manufacture, and to wafer manufacture. Guideline Ver 2.0 will announce this RDM activity has been developed the optimization of a new engineering chain management in addition to the pattern data and the linkage to EDA in 2003.

Key concepts: Reticle, RDM, Guideline, Standardization, Manufacturing engineering, Linkage (software), PDCA, Wafer

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