2010•Microelectronic EngineeringRequires access

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

Jan Van Olmen, Cedric Huyghebaert, Jan Coenen, J. Van Aelst, Erik Sleeckx, A. Van Ammel, Silvia Armini, Guruprasad Katti, Jan Vaes, Wim Dehaene, Eric Beyne, Youssef Travaly

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Key concepts: Through-silicon via, Three-dimensional integrated circuit, Copper, Materials science, Key (lock), Silicon, Ring (chemistry), Optoelectronics

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Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration — Research Paper | ScholarLens