2014•Unpublished venueRequires access

Static and dynamic characterization of high power silicon carbide BJT modules

Muhammad Imran Nawaz, Nan Chen, Filippo Chimento, Liwei Wang

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Abstract

Silicon carbide (SiC) based power semiconductor devices are now considered as key components for future power applications where high power density, high temperature and high ruggedness against radiation are key parameters. This thanks to lower conduction and switching losses offered by the SiC devices. This paper deals with static and dynamic measurements performed for SiC based BJTs (Bipolar Junction Transistors) power modules with voltage rating 1200 V and current rating 800 A. The power modules are fabricated in flexible half bridge configuration in order to allow either full power module with 2400 V and 800 A as one power switch or by using two parallel 1200 V and 400 A half bridge legs. Results from engineering samples show overall good confidence as promised by the manufacturer for most of the transistor samples. A 40-50% reduction in the current gain was observed when temperature was increased to 475K as expected. Bipolar devices have been found out fairly stable under continuous static operation at nominal current levels.

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What this paper is about

Silicon carbide (SiC) based power semiconductor devices are now considered as key components for future power applications where high power density, high temperature and high ruggedness against radiation are key parameters. This thanks to lower conduction and switching losses offered by the SiC devices. This paper deals with static and dynamic measurements performed for SiC based BJTs (Bipolar Junction Transistors) power modules with voltage rating 1200 V and current rating 800 A. The power modules are fabricated in flexible half bridge configuration in order to allow either full power module with 2400 V and 800 A as one power switch or by using two parallel 1200 V and 400 A half bridge legs. Results from engineering samples show overall good confidence as promised by the manufacturer for most of the transistor samples. A 40-50% reduction in the current gain was observed when temperature was increased to 475K as expected. Bipolar devices have been found out fairly stable under continuous static operation at nominal current levels.

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Available abstract

Silicon carbide (SiC) based power semiconductor devices are now considered as key components for future power applications where high power density, high temperature and high ruggedness against radiation are key parameters. This thanks to lower conduction and switching losses offered by the SiC devices. This paper deals with static and dynamic measurements performed for SiC based BJTs (Bipolar Junction Transistors) power modules with voltage rating 1200 V and current rating 800 A. The power modules are fabricated in flexible half bridge configuration in order to allow either full power module with 2400 V and 800 A as one power switch or by using two parallel 1200 V and 400 A half bridge legs. Results from engineering samples show overall good confidence as promised by the manufacturer for most of the transistor samples. A 40-50% reduction in the current gain was observed when temperature was increased to 475K as expected. Bipolar devices have been found out fairly stable under continuous static operation at nominal current levels.

Key concepts: Silicon carbide, Materials science, Bipolar junction transistor, Power semiconductor device, Power module, Transistor, Junction temperature, Power (physics)

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