2010Unpublished venueRequires access

A 3-dimensional Vernier ring time-to-digital converter in 0.13µm CMOS

Jianjun Yu, Fa Foster Dai

Open publisher page 20 citations

Abstract

A 3-dimensional Vernier ring time-to-digital converter (TDC) is presented for the first time that greatly improves the measurement time and power consumption and achieves large detectable range and fine resolution simultaneously. The TDC prototype chip achieves 16.5-ps resolution and an 8-bit detectable range with 0.16 mm2die area in a 0.13μm CMOS technology. The power consumption for the entire TDC is only 4.5mW with 1.5V power supply at 15MSps sample rate.

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What this paper is about

A 3-dimensional Vernier ring time-to-digital converter (TDC) is presented for the first time that greatly improves the measurement time and power consumption and achieves large detectable range and fine resolution simultaneously. The TDC prototype chip achieves 16.5-ps resolution and an 8-bit detectable range with 0.16 mm2die area in a 0.13μm CMOS technology. The power consumption for the entire TDC is only 4.5mW with 1.5V power supply at 15MSps sample rate.

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OpenAlex reports 20 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

A 3-dimensional Vernier ring time-to-digital converter (TDC) is presented for the first time that greatly improves the measurement time and power consumption and achieves large detectable range and fine resolution simultaneously. The TDC prototype chip achieves 16.5-ps resolution and an 8-bit detectable range with 0.16 mm2die area in a 0.13μm CMOS technology. The power consumption for the entire TDC is only 4.5mW with 1.5V power supply at 15MSps sample rate.

Key concepts: Vernier scale, CMOS, Time-to-digital converter, Chip, Resolution (logic), Power consumption, Power (physics), Ring (chemistry)

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