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1998•Thin Solid FilmsRequires access

Improved TiN film as a diffusion barrier between copper and silicon

Sa‐Kyun Rha, Won‐Jun Lee, Seung Yun Lee, Yong-Sup Hwang, Yoon-Jik Lee, Dong Il Kim, Dong‐Won Kim, Soung-Soon Chun, Chong-Ook Park

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Key concepts: Tin, Diffusion barrier, Copper, Materials science, Diffusion, Grain boundary, Barrier layer, Metallurgy

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