1998Japanese Journal of Applied PhysicsRequires access

Size Fluctuation of 50 nm Periodic GaInAsP/InP Wire Structure by Electron Beam Lithography and Wet Chemical Etching

Takashi Kojima, Xueying Jia, Yoshinori Hayafune, Shigeo Tamura Shigeo Tamura, M. Watanabe, Shigehisa Arai

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Abstract

We investigated a size fluctuation of 50 nm periodic wire pattern of GaInAsP/InP structure with a typical wire width of around 30 nm, which was fabricated by an electron beam lithography followed by wet chemical etching. The size fluctuation of the ZEP-520 positive resist pattern was reduced from 2.7 nm to 1.4 nm by using a corrected dose profile taking the proximity effect into account, and that of the quantum-wire structure after wet etching was reduced from 3.8 nm to 2.9 nm.

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What this paper is about

We investigated a size fluctuation of 50 nm periodic wire pattern of GaInAsP/InP structure with a typical wire width of around 30 nm, which was fabricated by an electron beam lithography followed by wet chemical etching. The size fluctuation of the ZEP-520 positive resist pattern was reduced from 2.7 nm to 1.4 nm by using a corrected dose profile taking the proximity effect into account, and that of the quantum-wire structure after wet etching was reduced from 3.8 nm to 2.9 nm.

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Available abstract

We investigated a size fluctuation of 50 nm periodic wire pattern of GaInAsP/InP structure with a typical wire width of around 30 nm, which was fabricated by an electron beam lithography followed by wet chemical etching. The size fluctuation of the ZEP-520 positive resist pattern was reduced from 2.7 nm to 1.4 nm by using a corrected dose profile taking the proximity effect into account, and that of the quantum-wire structure after wet etching was reduced from 3.8 nm to 2.9 nm.

Key concepts: Electron-beam lithography, Etching (microfabrication), Lithography, Resist, Materials science, Isotropic etching, Dry etching, Cathode ray

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