Surface Oxidation of Silicon Nitride Films
Stanley I. Raider, Richard Flitsch, J. A. Aboaf, W. A. Pliskin
Abstract
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Stanley I. Raider, Richard Flitsch, J. A. Aboaf, W. A. Pliskin
Abstract
Open-access reader
ESCA is used to characterize silicon nitride surface oxidation. Si 2p, N 1s, and O 1s binding energies and photoelectron line intensities of oxidized nitride films are compared with the corresponding lines from thick reference films of silicon, silicon nitride, silcon dioxide, and a series of oxynitrides. Rapid initial oxidation of silicon nitride surfaces occurs at room temperature on exposure of nitride films to air. A graded oxidized nitride film forms between the film surface and the nitride. Similarly, oxynitride films with gradations in composition are obtained upon oxidation of nitride films at high temperatures.
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ESCA is used to characterize silicon nitride surface oxidation. Si 2p, N 1s, and O 1s binding energies and photoelectron line intensities of oxidized nitride films are compared with the corresponding lines from thick reference films of silicon, silicon nitride, silcon dioxide, and a series of oxynitrides. Rapid initial oxidation of silicon nitride surfaces occurs at room temperature on exposure of nitride films to air. A graded oxidized nitride film forms between the film surface and the nitride. Similarly, oxynitride films with gradations in composition are obtained upon oxidation of nitride films at high temperatures.
Key concepts: Silicon nitride, Nitride, Materials science, Silicon oxynitride, Silicon dioxide, LOCOS, X-ray photoelectron spectroscopy, Silicon