2002•Winter Simulation ConferenceRequires access

Modeling methodology: simulation based cause and effect analysis of cycle time and WIP in semiconductor wafer fabrication

Chao Qi, Tuck Keat Tang, Appa Lyer Sivakumar

Abstract

Semiconductor wafer fabrication is perhaps one of the most complex manufacturing processes found today. In this paper, we construct a simulation model of part of a wafer fab using ProModel® software and analyze the effect of different input variables on selected parameters, such as cycle time, WIP level and equipment utilization rates. These input variables include arrival distribution, batch size, downtime pattern and lot release control. SEMATECH DATASET which has the original actual wafer fab data is used for our analysis.

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Available abstract

Key concepts: Wafer fabrication, Semiconductor device fabrication, Downtime, Wafer, Reliability engineering, Semiconductor device modeling, Engineering, Wafer testing