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Novel multilayered Ti/TiN diffusion barrier for Al metallization

Wen-Fa Wu, Kou-Chiang Tsai, Chuen-Guang Chao, Jen-Chung Chen, Keng‐Liang Ou

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Key concepts: Tin, Diffusion barrier, Titanium nitride, Barrier layer, Materials science, Titanium, Layer (electronics), Sputtering

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