2023•Materials LettersRequires access

Diffusion barrier property of Co-W layer compared with Ni layer in fine pitch micro-bumps during high temperature storage

Yuexiao Liu, Peixin Chen, Yan Peng, Ming Li, Anmin Hu

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Key concepts: Diffusion barrier, Materials science, Barrier layer, Diffusion, Electromigration, Amorphous solid, Melting point, Layer (electronics)

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