Circuit techniques for low-power CMOS GSI

For a prescribed system performance, device, circuit and system design of a static CMOS datapath are conjointly optimized for different operating temperature ranges. Total power dissipation is reduced to one-third the value projected for 0.25 micron CMOS by the National Technology Roadmap for Semiconductors for a single datapath and to less than one-fourteenth the value projected for parallel datapaths assuming operation over a temperature range of 60/spl deg/K above room temperature.