Optimal low power interconnect networks
Jeffrey A. Davis, Vivek K. De, JAMES D. MEINDL
Abstract
Jeffrey A. Davis, Vivek K. De, JAMES D. MEINDL
Abstract
Because interconnect capacitance represents the dominant load capacitance in CMOS VLSI systems, dynamic power dissipation is largely determined by multilevel wiring requirements. Using a newly derived stochastic interconnect distribution, a model for total on-chip power dissipation is developed. With this new model, the optimal interconnect dimensions for a multilevel network can be determined that minimize chip size and power drain.
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Because interconnect capacitance represents the dominant load capacitance in CMOS VLSI systems, dynamic power dissipation is largely determined by multilevel wiring requirements. Using a newly derived stochastic interconnect distribution, a model for total on-chip power dissipation is developed. With this new model, the optimal interconnect dimensions for a multilevel network can be determined that minimize chip size and power drain.
Key concepts: Interconnection, Dissipation, Capacitance, Very-large-scale integration, CMOS, Electronic engineering, Chip, Power (physics)