2002•Unpublished venueRequires access

Optimal low power interconnect networks

Jeffrey A. Davis, Vivek K. De, JAMES D. MEINDL

Open publisher page 19 citations

Abstract

Because interconnect capacitance represents the dominant load capacitance in CMOS VLSI systems, dynamic power dissipation is largely determined by multilevel wiring requirements. Using a newly derived stochastic interconnect distribution, a model for total on-chip power dissipation is developed. With this new model, the optimal interconnect dimensions for a multilevel network can be determined that minimize chip size and power drain.

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What this paper is about

Because interconnect capacitance represents the dominant load capacitance in CMOS VLSI systems, dynamic power dissipation is largely determined by multilevel wiring requirements. Using a newly derived stochastic interconnect distribution, a model for total on-chip power dissipation is developed. With this new model, the optimal interconnect dimensions for a multilevel network can be determined that minimize chip size and power drain.

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OpenAlex reports 19 citations for this work. Citation counts describe recorded attention and do not establish research quality.

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Available abstract

Because interconnect capacitance represents the dominant load capacitance in CMOS VLSI systems, dynamic power dissipation is largely determined by multilevel wiring requirements. Using a newly derived stochastic interconnect distribution, a model for total on-chip power dissipation is developed. With this new model, the optimal interconnect dimensions for a multilevel network can be determined that minimize chip size and power drain.

Key concepts: Interconnection, Dissipation, Capacitance, Very-large-scale integration, CMOS, Electronic engineering, Chip, Power (physics)

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