2004•Thin Solid FilmsRequires access

Evaluation of advanced chemical mechanical planarization techniques for copper damascene interconnect

K.W. Chen, Y. L. Wang, Chun‐Hua Liu, Kevin Yang, L. Chang, Kuang-Yao Lo, C. W. Liu

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Key concepts: Copper interconnect, Chemical-mechanical planarization, Interconnection, Copper, Materials science, Metallurgy, Computer science, Polishing