A Method for Assembling Nano-Electromechanical Devices on Microcantilevers Using Focused Ion Beam Technology

We propose a new method for assembling nano-electromechanical devices using focused ion beam (FIB) technology. After milling the area surrounding a device (30 µm×10 µm), a small chip containing nano-four-point probes with 60-nm-pitch Si electrodes was picked up by a microprobe and transferred to a scanning probe microscopy (SPM) microcantilever with four aluminum electrodes. Interconnections by tungsten (W) lines between the Si electrodes of the nanodevice and the Al electrodes of the cantilever were formed by FIB-induced gas deposition. The connection of FIB-W lines was confirmed by biased scanning electron microscopy (SEM). We successfully demonstrated a nano-four-point probe system on an SPM cantilever.