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1999•Japanese Journal of Applied PhysicsRequires access

Precise Velocity Measurements for Thin Specimens by Line-Focus-Beam Acoustic Microscopy

Jun-ichi Kushibiki Jun-ichi Kushibiki, Yuji Ohashi, Mototaka Arakawa

Open publisher page 7 citations

Abstract

When line-focus-beam acoustic microscopy is applied to thin specimens, waves reflected from the back surface of the specimen cause a serious problem in measurement accuracy of measured leaky surface acoustic wave (LSAW) velocities. Experimental results show that the velocities vary not only with the employed ultrasonic frequency but also with the specimen thickness. A method of eliminating that influence using the moving average of the frequency dependence of LSAW velocities is proposed and demonstrated for a Z-cut 5-mol% MgO-doped LiNbO3 wafer specimen about 380-µm thick.

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What this paper is about

When line-focus-beam acoustic microscopy is applied to thin specimens, waves reflected from the back surface of the specimen cause a serious problem in measurement accuracy of measured leaky surface acoustic wave (LSAW) velocities. Experimental results show that the velocities vary not only with the employed ultrasonic frequency but also with the specimen thickness. A method of eliminating that influence using the moving average of the frequency dependence of LSAW velocities is proposed and demonstrated for a Z-cut 5-mol% MgO-doped LiNbO3 wafer specimen about 380-µm thick.

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Available abstract

When line-focus-beam acoustic microscopy is applied to thin specimens, waves reflected from the back surface of the specimen cause a serious problem in measurement accuracy of measured leaky surface acoustic wave (LSAW) velocities. Experimental results show that the velocities vary not only with the employed ultrasonic frequency but also with the specimen thickness. A method of eliminating that influence using the moving average of the frequency dependence of LSAW velocities is proposed and demonstrated for a Z-cut 5-mol% MgO-doped LiNbO3 wafer specimen about 380-µm thick.

Key concepts: Materials science, Wafer, Acoustic microscopy, Optics, Focus (optics), Microscopy, Beam (structure), Line (geometry)

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