2002•Unpublished venueRequires access
An integral equation approach to the prediction of the capacitance and the inductance of a via through-hole
P. Kok, D. De Zutter
Open publisher page 2 citations
Abstract
A quasi-static method is described for calculating the excess capacitance and inductance of via's. The considered via geometry contains connecting strips, pads on the via, and finite ground plane thickness. The influence of the pad size and the size of the ground plane opening on the via capacitance, inductance and impedance is examined.>