2004Unpublished venueRequires access

A novel fabrication process of 3-D microstructures by double exposure in standard deep X-ray lithography

Naoki Matsuzuka, Yoshikazu Hirai, Osamu Tabata

Open publisher page 8 citations

Abstract

This paper reports a novel fabrication process of 3 dimensional (3-D) micro structures by double X-ray exposure in standard deep X-ray lithography (DXL). The proposed fabrication process made it possible to realize 3-D microstructures with an inclined and curved sidewall without any apparatuses and difficult process control. In order to demonstrate the feasibility of the double X-ray exposure technique, a micro-needle array fabrication was carried out. The sharp micro-needle array with the top radius of less than 100 nm was easily and successfully fabricated by the double X-ray exposure method.

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What this paper is about

This paper reports a novel fabrication process of 3 dimensional (3-D) micro structures by double X-ray exposure in standard deep X-ray lithography (DXL). The proposed fabrication process made it possible to realize 3-D microstructures with an inclined and curved sidewall without any apparatuses and difficult process control. In order to demonstrate the feasibility of the double X-ray exposure technique, a micro-needle array fabrication was carried out. The sharp micro-needle array with the top radius of less than 100 nm was easily and successfully fabricated by the double X-ray exposure method.

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Available abstract

This paper reports a novel fabrication process of 3 dimensional (3-D) micro structures by double X-ray exposure in standard deep X-ray lithography (DXL). The proposed fabrication process made it possible to realize 3-D microstructures with an inclined and curved sidewall without any apparatuses and difficult process control. In order to demonstrate the feasibility of the double X-ray exposure technique, a micro-needle array fabrication was carried out. The sharp micro-needle array with the top radius of less than 100 nm was easily and successfully fabricated by the double X-ray exposure method.

Key concepts: Fabrication, Lithography, Materials science, X-ray lithography, Process (computing), X-ray, Resist, Optoelectronics

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