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A 5V-0nly 256K CMOS EEPROM using Barrier Height Lowering Technique

Jun-ichi Tsujimotq, Junichi Miyamoto, N. Matsukawa, K. Shinada, S. Morita, Hiroshi Nozawa, Tetsuya Iizuka

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Abstract

A 256k (32k × 8b) 5V-only EEPROM with high-density structure cell has been developed. The EEPROM, offering typically 150ns address access time, 80mW active, and 1μW standby power dissipation, was successfully fabricated by a single-polysilicon and single metal CMOS process with a 1.2 μm photo lithography.

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What this paper is about

A 256k (32k × 8b) 5V-only EEPROM with high-density structure cell has been developed. The EEPROM, offering typically 150ns address access time, 80mW active, and 1μW standby power dissipation, was successfully fabricated by a single-polysilicon and single metal CMOS process with a 1.2 μm photo lithography.

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Available abstract

A 256k (32k × 8b) 5V-only EEPROM with high-density structure cell has been developed. The EEPROM, offering typically 150ns address access time, 80mW active, and 1μW standby power dissipation, was successfully fabricated by a single-polysilicon and single metal CMOS process with a 1.2 μm photo lithography.

Key concepts: EEPROM, CMOS, EPROM, Electrical engineering, Lithography, Electronic engineering, Dissipation, Standby power

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