Quantitative Measurement of Out-of-plane Deformation Using Shearography

Electronic Speckle Pattern Interferometry(ESPI) is a common method for measuring out-of-plane deformation and in-plane deformation and applied for vibration analysis and strain/stress analysis. However, ESPI is sensitive to environmental disturbance, which provide the limitation of industrial application. On the other hand, Shearography based on shearing interferometer which is insensitive to vibration disturbance can directly measure the first derivative of out-of-plane deformation. In this paper a technique that extract out-of-plane deformation from results of shearography by numerical processing is proposed and measurement results of ESPI and Shearoraphy are compared quantitatively.