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High-temperature adhesives for bonding polyimide film

Anne K. St. Clair, Wayne S. Slemp, T. L. St. Clair

Abstract

Experimental polyimide resins were developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of Kapton/Kapton bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575 K (575 F) in vacuum. Glass transition temperatures of the polyimide/Kapton bondlines were monitored by thermomechanical analysis.

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Key concepts: Kapton, Polyimide, Materials science, Adhesive, Composite material, Layer (electronics)