Polyimide resins with superior thermal stability, dielectric properties, and solubility obtained by introducing trifluoromethyl and diphenylpyridine with different bulk pendant groups
Shuanger Li, Haoran Zhu, Feng Bao, Xiaoqian Lan, Hong Li, Yadong Li, Yadong Li, Mingliang Wang, Caizhen Zhu, Jian Xu
Abstract