Thin Film Deposition Techniques—An Overview

Abstract This chapter presents the theory and practice associated with the application of thin films. The first half of the chapter describes physical deposition processes in which functional coatings are deposited on component surfaces using mechanical, electromechanical, or thermodynamic techniques. Physical vapor deposition (PVD) techniques include sputtering, e-beam evaporation, arc-PVD, and ion plating and are best suited for elements and compounds with moderate melting points or when a high-purity film is required. The remainder of the chapter covers chemical vapor deposition (CVD) processes, including atomic layer deposition, plasma-enhanced and plasma-assisted CVD, and various forms of vapor-phase epitaxy, which are commonly used for compound films or when deposit purity is less critical. A brief application overview is also presented.