FEM Based Modelling of Electronic chip cooling using Heat Sink

In portable electronic industries the thermal management of microelectronics is most important and it thresholds in high performance. As the energy density and heat dissipation in electronic equipment increased, fluid cooling techniques were made more necessary for efficient thermal management. Liquid cooling became increasingly necessary to keep the Chip temperatures acceptable due to increasing power density of microelectronic modules. When an inefficient cooling approach is applied particularly for high-performance computing processors (HPC), increases temperature and failure rate. Heat sinks with corrugated fins have been developed for the effective cooling of integrated large-scale circuits (LSIC). The PCM heat sinks are used to store the heat dissipated from electronics. The electronic components delay the peak temperature so that release and store energy during the off period. An analytical model of the flow and heat transfer in microchannel heat sinks is also presented.