Low-Loss 140-175 GHz MMIC-to-Waveguide Transitions and MMIC-to-MMIC Interconnections
Jian Ding, Xiaobang Shang, Chris Buck, Mike Geen, Nick Ridler
Abstract
Jian Ding, Xiaobang Shang, Chris Buck, Mike Geen, Nick Ridler
Abstract
This work presents two types of direct MMIC-to-waveguide (WG) transitions and two types of MMIC-to-MMIC interconnections between 140 to 175 GHz. A periodic electromagnetic bandgap (EBG) structure is used in the MMIC-to-WG transitions to suppress unwanted resonances and help the coupling between the microstrip mode and the waveguide mode. Measurement of the two types of MMIC-to-WG transitions shows 0.38 to 0.63 dB and 0.32 to 0.62 dB insertion loss respectively. Insertion loss of hot-via based MMIC-to-MMIC interconnection is found to be between 0.54 to 1.88 dB. Another MMIC-to-MMIC interconnection method using a piece of CPW quartz board achieves 0.31 to 1.08 dB insertion loss.
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This work presents two types of direct MMIC-to-waveguide (WG) transitions and two types of MMIC-to-MMIC interconnections between 140 to 175 GHz. A periodic electromagnetic bandgap (EBG) structure is used in the MMIC-to-WG transitions to suppress unwanted resonances and help the coupling between the microstrip mode and the waveguide mode. Measurement of the two types of MMIC-to-WG transitions shows 0.38 to 0.63 dB and 0.32 to 0.62 dB insertion loss respectively. Insertion loss of hot-via based MMIC-to-MMIC interconnection is found to be between 0.54 to 1.88 dB. Another MMIC-to-MMIC interconnection method using a piece of CPW quartz board achieves 0.31 to 1.08 dB insertion loss.
Key concepts: Monolithic microwave integrated circuit, Interconnection, Insertion loss, Microstrip, Materials science, Optoelectronics, Electrical engineering, Waveguide