Investigation of conventional deep drawing and hydroforming deep drawing via experimental and finite element simulation
S.A. Zahedi
Abstract
S.A. Zahedi
Abstract
Deep drawing and hydroforming deep drawing (HDD) are the two conventional methods for production of cylindrical cups. In this paper, two cylindrical workpieces have been produced with separated dies and the deformation force and sheet thickness distributions have been compared. For increasing drawing ratio in the hydroforming deep drawing, pressure chamber must be calculated and exerted properly. Limited tearing pressure curve have been obtained with finite element simulation. By considering of this approach and conducting a series of hydroforming experiments, proper pressure will be selected. Finally, workpiece was drawn with 2.3 drawing ratio by using proper pressure path. Results have shown that although hydroforming deep drawing needs more forces, more drawing ratio can be achieved as a result. Keywords: Conventional deep drawing, Hydroforming deep drawing (HDD), Finite element simulation.
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Deep drawing and hydroforming deep drawing (HDD) are the two conventional methods for production of cylindrical cups. In this paper, two cylindrical workpieces have been produced with separated dies and the deformation force and sheet thickness distributions have been compared. For increasing drawing ratio in the hydroforming deep drawing, pressure chamber must be calculated and exerted properly. Limited tearing pressure curve have been obtained with finite element simulation. By considering of this approach and conducting a series of hydroforming experiments, proper pressure will be selected. Finally, workpiece was drawn with 2.3 drawing ratio by using proper pressure path. Results have shown that although hydroforming deep drawing needs more forces, more drawing ratio can be achieved as a result. Keywords: Conventional deep drawing, Hydroforming deep drawing (HDD), Finite element simulation.
Key concepts: Hydroforming, Deep drawing, Finite element method, Tearing, Deformation (meteorology), Materials science, Die (integrated circuit), Computer simulation