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2020•Springer series in advanced microelectronicsRequires access

Fundamentals and Failures in Die Preparation for 3D Packaging

Huan Ma, Hualiang Shi, Poonjolai Erasenthiran

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Key concepts: Wafer dicing, Wafer, Die preparation, Die (integrated circuit), Materials science, Wafer testing, Wafer-level packaging, Wafer bonding

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