ESD, EOS, EMI, EMC, and Latchup

This chapter provides a short description of electrostatic discharge (ESD), electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC) and latchup. It introduces various ESD sources and models. The chapter focuses on the EOS issues, and the other areas. ESD is a subclass of EOS and may cause immediate device failure, permanent parameter shifts and latent damage causing increased degradation rate. EOS is a wide classification for over-current conditions for electronic components and electronic systems. EMI can lead to both component level or system level failure of electronic systems. EMI can lead to failure of electronic components, without physical contact to the electronic system. EMC has two features. The first feature is a source of emission of an electromagnetic field. The second feature is the collector of electromagnetic energy. The electrical connectivity of pads, circuits, and circuit functional blocks can influence the latchup robustness of a semiconductor chip.