2022•Topics in mining, metallurgy and materials engineeringRequires access

Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints

A. Atiqah, Azman Jalar, Maria Abu Bakar, Norliza Ismail

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Key concepts: Printed circuit board, Solderability, Soldering, Dip soldering, Intermetallic, Wave soldering, Materials science, Layer (electronics)

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Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints — Research Paper | ScholarLens