2021Unpublished venueRequires access

Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples

Takashi Fukue, Koichi Hirasawa

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Abstract

Abstract This study describes the development of an evaluation method of uncertainty in temperature measurement of surface-mounted components by several types of thermocouples. When thermocouples conduct the temperature measurement of the surface-mounted components, the components’ temperature decreases because the thermocouples dissipate heat like a pin fin. Temperature measurement techniques for miniaturized electrical components are strongly needed to ensure the operation’s guaranteed temperature. In this report, a heat transfer experiment around thermocouples installed on the surface of the PCBs was conducted while changing the type and the mounting angle of thermocouples. Through the temperature measurement, the decrease of the temperature around the thermocouples was confirmed.

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What this paper is about

Abstract This study describes the development of an evaluation method of uncertainty in temperature measurement of surface-mounted components by several types of thermocouples. When thermocouples conduct the temperature measurement of the surface-mounted components, the components’ temperature decreases because the thermocouples dissipate heat like a pin fin. Temperature measurement techniques for miniaturized electrical components are strongly needed to ensure the operation’s guaranteed temperature. In this report, a heat transfer experiment around thermocouples installed on the surface of the PCBs was conducted while changing the type and the mounting angle of thermocouples. Through the temperature measurement, the decrease of the temperature around the thermocouples was confirmed.

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Available abstract

Abstract This study describes the development of an evaluation method of uncertainty in temperature measurement of surface-mounted components by several types of thermocouples. When thermocouples conduct the temperature measurement of the surface-mounted components, the components’ temperature decreases because the thermocouples dissipate heat like a pin fin. Temperature measurement techniques for miniaturized electrical components are strongly needed to ensure the operation’s guaranteed temperature. In this report, a heat transfer experiment around thermocouples installed on the surface of the PCBs was conducted while changing the type and the mounting angle of thermocouples. Through the temperature measurement, the decrease of the temperature around the thermocouples was confirmed.

Key concepts: Thermocouple, Temperature measurement, Materials science, Heat transfer, Measurement uncertainty, Mechanical engineering, Acoustics, Mechanics

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