1995•대한금속재료학회지Requires access
Sn - Bi 계 Solder 에서 Sn 함량이 습윤성 및 계면반응에 미치는 영향
이경구, 이재진, 이도재
Open publisher page 0 citations
Abstract
Solderability and interfacial reaction between Cu-substrate and Sn-Bi solder were studied. Experimental variables included Sn contents, types of flux and soldering temperature. Some solder joints are subjected to aging treatments for up to 90 days to see interfacial reaction at 100℃. Analysing the experimental result concerning solderability, it was found that the role of Sn contents is increasing spread area on Cu substrate during soldering. A similar effect is observed by increasing soldering temperature and using activated flux(RMA flux) instead of using non-activated flux(R flux). According to the result of EDXS(Energy Dispersive X-ray Spectrometer), it is supposed that the soldered interfacial zone was composed of Cu₃Sn and Cu_6Sn_6. Those intermetallic compound formed in interfacial zone changed entirely to Cu₃Sn after 5days annealing at 100℃.