Heat Transfer Analysis of a 7.5W LED Load with Passive and Active cooling for Constant Luminance Applications
Sangmesh, Keshavanarayana Gopalakrishna, Krishna Arun Venkatesh
Abstract
Sangmesh, Keshavanarayana Gopalakrishna, Krishna Arun Venkatesh
Abstract
The aim of the present work is to study the thermal performance of a 7.5 W LED load with passive and active cooling and validation of the results using FEA analysis. In order to get a high cooling effect for 7.5W LED load, thermo electric cooling uses the peltier effect to create heat flux between the junctions of two different types of materials. A peltier cooler, which transfer heat from one side of the device to the other with the consumption of electrical energy, depends on the direction of the current. A peltier device (Active heat transfer device) is provided with the LED module for removal of heat generated in the module. The assembly (LED +heat sink +fan +peltier cooler) was tested for varying input power. With the use of the assembly, the junction temperatures were considerably reduced. The results indicate that, the assembly(case 4) performed better than any other cooling combinations. The validation of experimental data was done through FEA analysis.The differences between FEA results and the experimental values were 24%.
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The aim of the present work is to study the thermal performance of a 7.5 W LED load with passive and active cooling and validation of the results using FEA analysis. In order to get a high cooling effect for 7.5W LED load, thermo electric cooling uses the peltier effect to create heat flux between the junctions of two different types of materials. A peltier cooler, which transfer heat from one side of the device to the other with the consumption of electrical energy, depends on the direction of the current. A peltier device (Active heat transfer device) is provided with the LED module for removal of heat generated in the module. The assembly (LED +heat sink +fan +peltier cooler) was tested for varying input power. With the use of the assembly, the junction temperatures were considerably reduced. The results indicate that, the assembly(case 4) performed better than any other cooling combinations. The validation of experimental data was done through FEA analysis.The differences between FEA results and the experimental values were 24%.
Key concepts: Heat sink, Thermoelectric cooling, Junction temperature, Heat transfer, Materials science, Thermal management of high-power LEDs, Thermoelectric effect, Mechanical engineering