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2021•Materials CharacterizationRequires access

Work of adhesion and reactive wetting in SnPb/Cu,Ni and SnBi/Cu,Ni soldering systems

Samuel Griffiths, Andre Wedi, Guido Schmitz

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Key concepts: Wetting, Sessile drop technique, Soldering, Intermetallic, Materials science, Contact angle, Surface tension, Adhesion

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Work of adhesion and reactive wetting in SnPb/Cu,Ni and SnBi/Cu,Ni soldering systems — Research Paper | ScholarLens