Study on Influencing Factors and Laws of Temperature Field Distribution of Infrared Hot Air Reflow Soldering

Abstract The quality of solder joints formed by reflow soldering is closely related to the temperature profile of solder joint during the hot air reflow soldering process. The temperature profile of solder joint is directly determined by the process parameters of the reflow furnace as the layout of the PCB design remains same. In this paper, the temperature model of the printed board assembly during reflow soldering is numerically built and simulated to obtain the temperature distribution. Furtherly, several process parameters, such as the temperature of each temperature zone, convective heat transfer coefficient and conveyor belt speed of reflow soldering furnace, are selected as the input variables, and the heating factor, time of super liquidus and peak temperature are aimed as the output parameters. The Latin hypercube sampling design is applied to construct the response surface of the output parameters. The influence of these process parameters during the reflow soldering on the temperature profile of PCBA is studied comprehensively. The main influencing process parameters of the reflow soldering are identified and their influence laws are obtained. The research results provide valuable reference and basis for reflow soldering process design.