The Back‐End Connection

The interface between the connector and the connecting components (board or wire) is referred to as the “back-end” connection. The type of back-end connection depends on whether the connector is connected to a board or a wire. Soldering is the most widely used connection methodology. An insulation displacement connection (IDC) or crimping connection can also be used for connector-to-wire configurations. Solderless press-fit technique is widely applied for connector-to-board configuration. Each of these methodologies has advantages and limitations. This chapter focuses on the four back-end connection types: soldered connection, press-fit connection, crimping connection, and IDC. Compared to the crimp connection, the IDC method does not require a special tool and can be performed without stripping the insulation of the wire end.